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Volumn , Issue , 2006, Pages 236-244

Reliability analysis of self-repairable MEMS accelerometer

Author keywords

Fracture probability; MEMS (Microelectromechanical System); Micro accelerometer; Redundancy repair; Reliability

Indexed keywords

ACCELEROMETERS; BUILT-IN SELF TEST; RELIABILITY;

EID: 38749128002     PISSN: 15505774     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DFT.2006.54     Document Type: Conference Paper
Times cited : (12)

References (13)
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  • 2
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    • Muhlstein, C.L.1    Howe, R.T.2    Ritchie, R.O.3
  • 6
    • 0037257399 scopus 로고    scopus 로고
    • On the physics of stiction and its impact on the reliability of microstructures
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  • 13
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    • In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structure
    • S. Greek, F. Ericson, S. Johansson, and J. Schweitz, "In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structure", Thin Solid Films, Vol. 292, pp. 247-254, 1997.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.