Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath

International Journal of Minerals, Metallurgy and Materials

Volumn 16, Issue 2, 2009, Pages 197-202

  Liu, Wei Long ^a   Hsieh, Shu Huei ^a   Chen, Wen Jauh ^b  

^a Formosa University   (Taiwan)

^b NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

activation energy; electroless deposition; kinetics; Ni Cu P; silicon substrate

Indexed keywords

ELECTROLESS DEPOSITION; ELECTROLESS NI; ENERGY DISPERSIVE X-RAY; METAL SOURCES; MORPHOLOGY AND COMPOSITION; NI-CU-P; PH VALUE; PLATING BATH; SCANNING ELECTRON MICROSCOPE; SI SUBSTRATES; SILICON SUBSTRATE; TRANSMISSION ELECTRON MICROSCOPE; X RAY DIFFRACTOMETERS;

ACTIVATION ENERGY; DEPOSITS; ELECTROPLATING; MICROSCOPES; NICKEL; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY;

PH EFFECTS;

EID: 67649580777     PISSN: 16744799     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1674-4799(09)60033-9     Document Type: Article

References (25)

1. Zhao Q., Liu Y., Muller-Steinhagen H., and Liu G. Graded Ni-P-PTFE coatings and their potential applications. Surf. Coat. Technol. 155 (2002) 279
2. Liu Y., and Zhao Q. Effects of impurities on microstructure in Ni/YSZ-YSZ half-cells for SOFC. Trans. IMF 81 5 (2003) 1
3. Krasteva N., Fotty V., and Armyanov S. Thermal stability of electroless NiMeP amorphous alloys. J. Electrochem. Soc. 141 (1994) 2864
4. Wang Y.W., Xiao C.G., and Deng Z.G. Structure and corrosion-resistance of electroless Ni-Cu-P. Plat. Surf. Finish. 79 (1992) 57
5. Lee C.Y., and Lin K.L. Solderability of electroless nickel alloys using wetting balance technique. Jpn. J. Appl. Phys. 33 (1994) 4708
6. Hur K.H., Jeong J.H., and Lee D.N. Effect of annealing on magnetic properties and microstructure of electroless nickel-copper-phosphorus alloy deposits. J. Mater. Sci. 26 (1991) 2037
7. Nawafune H., Uegaki T., Mizumoto S., et al. Preparation and electrical resistance characteristics of electroless copper-nickel alloy deposits. Trans. IMF 76 (1998) 231
8. Gruss L.L., and Pearlstein F. Some studies of double-layer electroless Nickel deposits. Plat. Surf. Finish. 70 (1983) 47
9. Aoki K., and Takano O. Corrosion characteristics of crystalline and amorphous electroless nickel-tungsten-phosphorus deposits. Plat. Surf. Finish. 73 (1986) 136
10. Koiwa I., Usuda M., Yamada K., and Osaka T. Effect of heat-treatment on properties of electroless-deposited nickel-molybdenum-phosphorus alloy films. J. Electrochem. Soc. 135 (1988) 718
11. Yu H.S., Luo S.F., and Wang Y.R. A comparative study on the crystallization behavior of electroless Ni-P and Ni-Cu-P deposits. Surf. Coat. Technol. 148 2-3 (2001) 143
12. Krasteva N., Fotty V., and Armynaov S. Thermal stability of Ni-P and Ni-Cu-P amorphous alloys. J. Electrochem. Soc. 141 10 (1994) 2864
13. Liu Y., and Zhao Q. Study of electroless Ni-Cu-P coatings and their anti-corrosion properties. Appl. Surf. Sci. 228 (2004) 57
14. Mallory G.O., and Hajdu J.B. Electroless Plating: Foundamentals and Applications (1990), American Electroplaters and Surface Finishers Society, Orlando 263
15. L.L. Zhong, C.C. Liu, J.D. St. John, Electroless Nickel-Phosphorous Coatings with High Thermal Stability, US patent 6410104, 2002.
16. Chen C.J., and Lin K.L. Wetting interactions between the Ni-Cu-P deposit and In-Sn solders. IEEE Trans. Compon. Pack. Manuf. Technol. B 20 3 (1997) 211
17. Iwamatsu K. Electroless nickel polyalloy deposits. Met. Finish. 87 5 (1989) 25
18. Aymyanov S., Georgieva J., Tachev D., Calova E., Nyagolova N., Metha S., Leibman D., and Ruffini A. Electroless deposition of Ni-Cu-P alloys in acidic solutions. Electrochem. Solid State Lett. 2 7 (1999) 323
19. Ashassi-Sorkhabi H., Dolati H., Parvini-Ahmadi N., and Manzoori J. Electroless deposition of Ni-Cu-P alloy and study of the influences of some parameters on the properties of deposits. Appl. Surf. Sci. 185 (2002) 155
20. Balaraju J.N., Anandan C., and Rajam K.S. Morphological study of ternary Ni-Cu-P alloys by atomic force microscopy. Appl. Surf. Sci. 250 (2005) 88
21. Balaraju J.N., and Rajam K.S. Electroless deposition of Ni-Cu-P, Ni-W-P and Ni-W-Cu-P alloys. Surf. Coat. Technol. 195 (2005) 154
22. Yu H.S., Sun X., Luo S.F., Wang Y.R., and Wu Z.Q. Multifractal spectra of atomic force microscope images of amorphous electroless Ni-Cu-P alloy. Appl. Surf. Sci. 191 (2002) 123
23. Lin K.L., Chang Y.L., Huang C.C., Li F.I., and Hsu J.C. Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives. Appl. Surf. Sci. 181 (2001) 166
24. Chen C.J., and Lin K.L. Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum. Thin Solid Film 370 (2000) 106
25. Cheng D.H., Xu W.Y., Zhang Z.Y., and Yiao Z.H. Electroless copper plating using hypophosphite as reducing agent. Met. Finish. (1997) 34