Preparation and electrical resistance characteristics of electroless copper-nickel alloy deposits

Transactions of the Institute of Metal Finishing

Volumn 76, Issue 6, 1998, Pages 231-234

  Nawafune, Hidemi ^a   Uegaki, Takashi ^a   Mizumoto, Shozo ^a   Ishikawa, Masami ^b   Nakamura, Tsuneshi ^c  

^a KONAN UNIVERSITY   (Japan)

^b OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE   (Japan)

^c PANASONIC CORPORATION   (Japan)

Author keywords

Copper Nickel phosphorus alloy; Copper nickel alloy; Electroless deposition; Specific resistance; TCR (temperature coefficient of resistance)

Indexed keywords

BINARY ALLOYS; CRYSTALLIZATION; ELECTRIC RESISTANCE; ELECTROLESS PLATING; FORMALDEHYDE; HEAT TREATMENT; PHOSPHORUS COMPOUNDS;

HYPOPHOSPHITE; TEMPERATURE COEFFICIENT OF RESISTANCE (TCR);

COPPER ALLOYS;

EID: 0032206167     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.1998.11871231     Document Type: Article

References (2)

1. T. Osaka, I. Koiwa, Kinzoku Hyomen Gijutsu, 34, 330 (1983)
2. H. Nawafune, T. Uegaki, S. Mizumoto, M. Ishikawa, T. Nakamura, Hyomen Gijutsu, 48, 468 (1997)