Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives

Applied Surface Science

Volumn 181, Issue 1-2, 2001, Pages 166-172

  Lin, Kwang Lung ^a   Chang, Yu Lan ^a   Huang, Chiao Chan ^a   Li, Fang I ^a   Hsu, Jen Che ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Ni Cu P; Ni P; Saccharin; Thiourea

Indexed keywords

COPPER COMPOUNDS; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; DOPING (ADDITIVES); NICKEL COMPOUNDS; PHOSPHATE DEPOSITS; SURFACE ROUGHNESS;

ELECTROLESS;

ELECTRODEPOSITION;

EID: 0035801729     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(01)00387-7     Document Type: Article

References (9)

1. Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum
2. Electrochemical evaluation of electroless nickelplating
3. The fundamental aspects of electroless nickel plating