Morphological study of ternary Ni-Cu-P alloys by atomic force microscopy

Applied Surface Science

Volumn 250, Issue 1-4, 2005, Pages 88-97

  Balaraju, J N ^a   Anandan, C ^a   Rajam, K S ^a  

^a SURFACE ENGINEERING DIVISION   (India)

Author keywords

AFM; Corrosion; Electroless deposition; Ni Cu P; XPS

Indexed keywords

ATOMIC FORCE MICROSCOPY; COMPOSITION; COPPER ALLOYS; CORROSION; DUCTILITY; ELECTROLESS PLATING; HEAT RESISTANCE; METALLIC FILMS; MICROHARDNESS; MORPHOLOGY; SODIUM CHLORIDE; SOLUTIONS; TERNARY SYSTEMS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELEVATED TEMPERATURE; NI-CU-P; NONFERROMAGNETIC NATURE; TEMPERATURE COEFFICIENT OF RESISTANCE (TCR);

NICKEL ALLOYS;

EID: 23844455662     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2004.12.048     Document Type: Article

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