Electroless copper plating using hypophosphite as reducing agent

Metal Finishing

Volumn 95, Issue 1, 1997, Pages 36-38

  Cheng, D H ^a   Xu, W Y ^a   Zhang, Z Y ^a   Yiao, Z H ^a  

^a SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AGENTS; COATINGS; COMPOSITION EFFECTS; COPPER PLATING; ELECTROPLATING SOLUTIONS; MORPHOLOGY; PH EFFECTS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SODIUM COMPOUNDS; SURFACES;

BATH COMPOSITION; ELECTROLESS COPPER COATINGS; ELECTROLESS COPPER PLATING; HYPOPHOSPHITE; REDUCING AGENT;

ELECTROLESS PLATING;

EID: 0030832355     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)