Initial propagation stage of direct copper plating on non-conducting substrates

Electrochimica Acta

Volumn 44, Issue 21, 1999, Pages 3697-3705

  Ono, Sachiko ^a   Naitoh, Kazuhisa ^b   Osaka, Tetsuya ^c  

^a Ctr Informative and Environ Mat   (Japan)

^b Okuno Chemical Industries Co Ltd   (Japan)

^c WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSIS; COPPER OXIDES; CRYSTALS; ELECTRON DIFFRACTION; ELECTROPLATING; IONS; PALLADIUM; RESINS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TIN; TRANSMISSION ELECTRON MICROSCOPY;

ADDITIVE FREE METALLIC; COPPER DEPOSITION; COPPER PROPAGATION; DISPROPORTIONATION REACTION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPE; NONCONDUCTING RESINS;

COPPER;

EID: 0032685096     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(99)00073-0     Document Type: Article

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