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Volumn 255, Issue 5 PART 2, 2008, Pages 2813-2821

The diamond pyramid structure in electroless copper deposit, its atomic model and molecular dynamics simulation

Author keywords

Copper; Molecular dynamics simulation; Plating; Radial distribution function; Scanning electron microscopy

Indexed keywords

ATOMS; COPPER; COPPER DEPOSITS; DEPOSITS; DIAMOND DEPOSITS; DIAMONDS; DISTRIBUTION FUNCTIONS; PLATING; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION;

EID: 56949103173     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.08.018     Document Type: Article
Times cited : (10)

References (21)
  • 5
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    • J.Z. Rudolph, F.M. John, D.W. John, S. Frederick Jr., Electroless Copper Plating. United States Patent 3,095,309 (1963).
    • J.Z. Rudolph, F.M. John, D.W. John, S. Frederick Jr., Electroless Copper Plating. United States Patent 3,095,309 (1963).
  • 6
    • 56949090812 scopus 로고    scopus 로고
    • G.M. Wilkinson, C.A. Deckert, J.J. Doubrava, Metal Plating Process. United States Patent 4,751,106 (1988).
    • G.M. Wilkinson, C.A. Deckert, J.J. Doubrava, Metal Plating Process. United States Patent 4,751,106 (1988).
  • 15
    • 0004258899 scopus 로고    scopus 로고
    • ASM International, Materials Park (OH) p. 325
    • Smith D.K. ASM Handbook vol. 10 (1998), ASM International, Materials Park (OH) p. 325
    • (1998) ASM Handbook , vol.10
    • Smith, D.K.1
  • 16
    • 0004258899 scopus 로고    scopus 로고
    • ASM International, Materials Park (OH) p. 393
    • Konnert J.H., Karle J., and D'Antonio P. ASM Handbook vol. 10 (1998), ASM International, Materials Park (OH) p. 393
    • (1998) ASM Handbook , vol.10
    • Konnert, J.H.1    Karle, J.2    D'Antonio, P.3
  • 19
    • 56949104051 scopus 로고    scopus 로고
    • C.R. Shipley Jr., Method of Electroless Deposition on A Substrate and Catalyst Solution Therefore. United States Patent 3,011,920 (1961).
    • C.R. Shipley Jr., Method of Electroless Deposition on A Substrate and Catalyst Solution Therefore. United States Patent 3,011,920 (1961).
  • 20
    • 56949094893 scopus 로고    scopus 로고
    • E.D. D'Ottavio, Colloidal Metal Activating Solutions for Use in Chemically Plating Non-Conductors and Process of Preparing Such Solutions. United States Patent 3,532,518 (1970).
    • E.D. D'Ottavio, Colloidal Metal Activating Solutions for Use in Chemically Plating Non-Conductors and Process of Preparing Such Solutions. United States Patent 3,532,518 (1970).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.