Crack detection and analyses using resonance ultrasonic vibrations in crystalline silicon wafers

Conference Record of the 2006 IEEE 4th World Conference on Photovoltaic Energy Conversion, WCPEC-4

Volumn 1, Issue , 2006, Pages 920-923

  Ostapenko, Sergei ^a   Dallas, William ^a   Hess, Denial ^a   Polupan, Oleg ^a   Wohlgemuth, John ^b  

^a UNIVERSITY OF SOUTH FLORIDA   (United States)

^b BP Solar International Inc ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALLINE MATERIALS; RESONANCE; SILICON WAFERS; VIBRATION ANALYSIS;

CRYSTALLINE SILICON WAFERS; RESONANCE ULTRASONIC VIBRATIONS (RUV);

CRACK DETECTION;

EID: 41749087347     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/WCPEC.2006.279606     Document Type: Conference Paper

References (2)

1. A. Belyaev, O. Polupan, W. Dallas, S. Ostapenko, D, Hess, and J. Wohlgemuth "Crack Detection Using Resonance Ultrasonic Vibrations in Si Wafers", Appl. Phys. Lett. 88 (2006), pp. 111907-1.
2. A. Belyaev, O. Polupan, S. Ostapenko, D. Hess, and J. Kalejs "Resonance Ultrasonic Vibration Diagnostics of Elastic Stress in Full-Size Silicon Wafers" Semiconductor Science and Technology 21, (2006), pp. 254-260.