A microfluidic packaging technique for lab-on-chip applications

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 2, 2009, Pages 410-416

  Ghafar Zadeh, Ebrahim ^a   Sawan, Mohamad ^a   Therriault, Daniel ^b  

^a ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

^b DEPARTMENT OF CHEMICAL ENGINEERING   (Canada)

Author keywords

Complementary metal oxide semiconductor (CMOS); Direct write fabrication process; Integrated capacitive sensor; Lab on chip; Microfluidic packaging

Indexed keywords

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS); DIRECT-WRITE FABRICATION PROCESS; INTEGRATED CAPACITIVE SENSOR; LAB-ON-CHIP; MICROFLUIDIC PACKAGING;

DIELECTRIC DEVICES; FABRICATION; FLUIDIC LOGIC DEVICES; MICROELECTRONICS; MICROFLUIDICS; PACKAGING; SENSORS;

CHIP SCALE PACKAGES;

EID: 67349142030     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.920655     Document Type: Article

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