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Volumn 50, Issue 17, 2002, Pages 4369-4377

Combined effects of silica filler and its interface in epoxy resin

Author keywords

Composite; Hardness testing; Interface; Mechanical properties; Microstructure

Indexed keywords

ADHESION; CATALYSTS; EPOXY RESINS; FILLERS; HARDNESS TESTING; INTERFACES (MATERIALS); MICROSTRUCTURE; PARTICLES (PARTICULATE MATTER); STRESS CONCENTRATION; THERMAL EFFECTS; YIELD STRESS;

EID: 0037048577     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(02)00275-6     Document Type: Article
Times cited : (132)

References (16)
  • 3
    • 0031625577 scopus 로고    scopus 로고
    • High performance no flow underfills for low-cost flip-chip applications
    • San Jose, CA: Institute of Electrical and Electronics Engineers
    • Shi S.H., Wong C.P. High performance no flow underfills for low-cost flip-chip applications. In: Proceedings of the 47th Electronic Components and Technology Conference. San Jose, CA: Institute of Electrical and Electronics Engineers; 1998. p. 117.
    • (1998) Proceedings of the 47th Electronic Components and Technology Conference , pp. 117
    • Shi, S.H.1    Wong, C.P.2
  • 9
    • 4244051173 scopus 로고    scopus 로고
    • A study on the mechanical behavior of EMC and thermal stress analysis in plastic packaging
    • ASME
    • Shin D.K., Lee J.J. A study on the mechanical behavior of EMC and thermal stress analysis in plastic packaging. In: Advances in electronic packaging, EEP-vol 19-1. ASME; 1997. p. 253.
    • (1997) Advances in electronic packaging , vol.EEP-19-1 , pp. 253
    • Shin, D.K.1    Lee, J.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.