Precision in-plane hand assembly of bulk microfabricated components for high-voltage MEMS arrays applications

Journal of Microelectromechanical Systems

Volumn 18, Issue 2, 2009, Pages 332-346

  Gassend, Blaise ^a,b   Velásquez García, Luis Fernando ^a   Akinwande, Akintunde Ibitayo ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b EXPONENT INC   (United States)

Author keywords

Electrospray; High voltage MEMS packaging; MEMS hand assembly

Indexed keywords

3-D ELECTRODES; ASSEMBLY PROCESS; CANTILEVER TIPS; CLAMPING FORCES; DIFFERENTIAL THERMAL EXPANSIONS; ELECTRICAL INSULATIONS; ELECTROSPRAY; EXPERIMENTAL DATUM; EXPERIMENTAL VALIDATIONS; HIGH STIFFNESS; HIGH-VOLTAGE MEMS PACKAGING; IN PLANES; INSULATING SUBSTRATES; LOW-LEAKAGE CURRENTS; MICROFABRICATED; PROCESS FLOWS; REASSEMBLY; ROBUST ASSEMBLIES; STANDARD DEVIATIONS; TAPERED BEAMS; THIN-FILM COATINGS; TWO COMPONENTS; V-SHAPED NOTCHES;

ATOMIC FORCE MICROSCOPY; INSULATION; LEAKAGE CURRENTS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROFABRICATION; PHOTORESISTS; REACTIVE ION ETCHING; STIFFNESS; THERMAL EXPANSION; THREE DIMENSIONAL;

NANOCANTILEVERS;

EID: 67349089948     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2008.2011115     Document Type: Article

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