A microfabricated planar electrospray array ionic liquid ion source with integrated extractor

Journal of Microelectromechanical Systems

Volumn 18, Issue 3, 2009, Pages 679-694

  Gassend, Blaise ^a,b   Veĺasquez Garćia, Luis Fernando ^c   Akinwande, Akintunde Ibitayo ^c   Mart́inez Śanchez, Manuel ^c  

^a USA   (United States)

^b EXPONENT INC   (United States)

^c MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

3 D packaging; Arrays; Black silicon; Data mining; Electrospray array; Electrostatics; Insulation; Ion source; Ion sources; Ionic liquid; Liquids; Silicon

Indexed keywords

3-D MEMS; 3-D PACKAGING; ANODIC BONDING; ARRAYS; BEAM DIVERGENCE; BLACK SILICON; DEEP REACTIVE ION ETCHING; ELECTRICAL INSULATION; ELECTROSPRAY; ELECTROSPRAY ARRAY; ELECTROSPRAY EMITTER; EMITTER ARRAYS; EMITTER TIPS; EXPERIMENTAL CHARACTERIZATION; EXTRACTOR ELECTRODES; FUSION BONDING; IONIC LIQUID ION SOURCES; LOW TEMPERATURES; MICRO-FABRICATION TECHNIQUES; MICROELECTROMECHANICAL SYSTEMS; MICROFABRICATED; MOLECULAR IONS; NANOSATELLITE; PLANAR ARRAYS; SILICON SUBSTRATES; TIME OF FLIGHT MASS SPECTROMETRY; TWO-COMPONENT; WICKING;

BIAS VOLTAGE; COMPOSITE MICROMECHANICS; CURRENT VOLTAGE CHARACTERISTICS; DISSOCIATION; ELECTROMAGNETIC PULSE; ELECTRON BEAM LITHOGRAPHY; ELECTROSTATICS; INFORMATION MANAGEMENT; ION SOURCES; IONIZATION OF LIQUIDS; IONS; MASS SPECTROMETERS; MASS SPECTROMETRY; MEMS; MICROELECTROMECHANICAL DEVICES; MICROFABRICATION; MINING; REACTIVE ION ETCHING; THREE DIMENSIONAL;

IONIC LIQUIDS;

EID: 67549118712     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2009.2015475     Document Type: Article

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