Migration of species in a prototype diffusion barrier: Cu, O, and H in TiN

Applied Physics Letters

Volumn 94, Issue 16, 2009, Pages

  Tsetseris, L ^a,b   Logothetidis, S ^a   Pantelides, S T ^b,c  

^a ARISTOTLE UNIVERSITY OF THESSALONIKI   (Greece)

^b VANDERBILT UNIVERSITY   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC-SCALE PROCESS; CRYSTALLINITY; CU IMPURITIES; ELECTRONIC DEVICES; EXPERIMENTAL DATUM; FIRST-PRINCIPLES CALCULATIONS; INTER GRAINS; PHYSICAL MECHANISMS; RAPID DIFFUSIONS; TIN FILMS;

ACTIVATION ENERGY; COPPER; DIFFUSION; STOICHIOMETRY; TITANIUM COMPOUNDS; TITANIUM NITRIDE;

DIFFUSION BARRIERS;

EID: 65449140940     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3122344     Document Type: Article

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