A Study on the Grain Boundary Diffusion of Copper in Tantalum Nitride Thin Films

Electrochemical and Solid-State Letters

Volumn 2, Issue 2-4, 1999, Pages 181-183

  Lin, Jing Cheng ^a   Lee, Chiapyng ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; COPPER; CRYSTAL LATTICES; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; MORPHOLOGY; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY CRYSTALLOGRAPHY;

TANTALUM NITRIDE; WHIPPLE ANALYSIS;

TANTALUM COMPOUNDS;

EID: 0033116395     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390776     Document Type: Article

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