Smart ultrasonic transducer for wire-bonding applications

Materials Chemistry and Physics

Volumn 75, Issue 1-3, 2002, Pages 95-100

  Chu, Paul Wing Po ^a   Li, Hing Leung ^a,b   Chan, Helen Lai Wa ^a   Ng, Kelvin Ming Wai ^b   Liu, Peter Chou Kee ^b  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

PZT sensor; Smart transducer; Wire bond; Wire bonding quality monitoring

Indexed keywords

BONDING; ELECTRODES; INTELLIGENT MATERIALS; LEAD COMPOUNDS; SENSORS;

SMART TRANSDUCERS; WIRE BONDING;

ULTRASONIC TRANSDUCERS;

EID: 0037188153     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(02)00038-X     Document Type: Conference Paper

References (6)