Thermosonic flip chip bonding for low cost packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 360-365

  Tomioka, Taizo ^a   Iguchi, Tomohiro ^a   Mori, Ikuo ^a   Saito, Masayuki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Flip chip; Gold ball bump; Low pin count chip; Thermosonic bonding

Indexed keywords

BONDING; CERAMIC MATERIALS; ELECTRODES; FLIP CHIP DEVICES; OPTIMIZATION; SEMICONDUCTOR DEVICE MANUFACTURE;

BONDABILITY; GOLD BALL BUMP; LOW COST PACKAGING; SUBSTRATE ELECTRODES; THERMOSONIC FLIP CHIP BONDING;

ELECTRONICS PACKAGING;

EID: 0036448318     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. K.Shimokawa, T.Komatsu, N.Watanabe, I.Mori, "Flip Chip Bonding Technology using No-flow Underfill Resin," Proceedings of the 7th Symposium on Microjoining and Assembly Technology in Electronics, pp. 147-152,2001.
2. B.M.MacDonald, S.P.Rogerson and P.D.Walmsley, "Flip Chip Assembly of Surface Acoustic Wave Devices," Proceedings of the IEEE 1984 Ultrasonic Symposium, pp.36-39, 1984.
3. H.Yatsuda and T.Eimura, "Flip-Chip Assembly Technique for SAW Devices," Proceedings of the 1995 ISHM International Symposium on Microelectronics, pp.365-370, 1995