Effect of cerium oxide particle sizes in oxide chemical mechanical planarization

Electrochemical and Solid-State Letters

Volumn 12, Issue 6, 2009, Pages

  Sampurno, Yasa ^a   Sudargho, Fransisca ^a,b   Zhuang, Yun ^a,b   Ashizawa, Toranosuke ^c   Morishima, Hiroyuki ^c   Philipossian, Ara ^a,b  

^a University of Arizona   (United States)

^b Araca Inc   (United States)

^c High Performance Materials Department   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVE PARTICLE SIZES; CERIUM OXIDES; CHEMICAL MECHANICAL PLANARIZATION; CO-EFFICIENT OF FRICTIONS; DOWN FORCES; MEDIAN PARTICLE SIZES; OXIDE CHEMICAL MECHANICAL PLANARIZATION; REMOVAL RATES; SHEAR FORCES; TETRAETHYL ORTHOSILICATE; TRIBOMETER;

CERIUM; CERIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; NANOCRYSTALLINE MATERIALS; OXIDES; PARTICLE SIZE ANALYSIS; PLASMA DIAGNOSTICS; POLISHING;

PARTICLE SIZE;

EID: 64549134264     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3098401     Document Type: Article

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