Film properties of copper grown by the electroplating process

Journal of the Korean Physical Society

Volumn 38, Issue 3, 2001, Pages 232-235

  Park, Byung Nam ^a   Bae, Seong Chan ^a   Son, Seung Hyun ^a   Lee, Jong Hyun ^a   Choi, Sie Young ^a   Suk, Chang Gil ^b   Choi, Jin Kwang ^b  

^a Kyungpook National University   (South Korea)

^b Ultech CoLtd   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035532410     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

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7. J. Tao IEEE Trans. Electron Dev. Lett. 13, 433 (1992).
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