A review of creep fatigue failure models in solder material - Simplified use of a continuous damage mechanical approach

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 465-472

  Massiot, Gregor ^a   Munier, Catherine ^a  

^a AIRBUS GROUP INNOVATIONS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; CYCLIC LOADS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); KINEMATICS; LEAD; NUCLEATION; NUMERICAL METHODS; SOLDERING ALLOYS; STRAIN RATE; THERMAL EFFECTS; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT; THERMOSTATS; VISCOPLASTICITY;

CREEP FATIGUE MODELLING; INELSTIC ENERGY DENSITY; SOLDER MATERIALS; THERMAL CYCLE;

ELECTRONICS INDUSTRY;

EID: 3843144979     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

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