-
1
-
-
0036928692
-
-
0021-8979
-
A. Hokazono, K. Ohuchi, M. Takayanagi, Y. Watanabe, S. Magoshi, Y. Kato, T. Shimizu, S. Mori, H. Oguma, T. Sasaki, H. Yoshimura, and K. Miyano, Tech. Dig.-Int. Electron Devices Meet. 2002, 639. 0021-8979
-
Tech. Dig.-Int. Electron Devices Meet.
, vol.2002
, pp. 639
-
-
Hokazono, A.1
Ohuchi, K.2
Takayanagi, M.3
Watanabe, Y.4
Magoshi, S.5
Kato, Y.6
Shimizu, T.7
Mori, S.8
Oguma, H.9
Sasaki, T.10
Yoshimura, H.11
Miyano, K.12
-
2
-
-
0033307578
-
-
0021-8979
-
H. Wakabyashi, Y. Saito, K. Takeuchi, T. Mogami, and T. Kunio, Tech. Dig.-Int. Electron Devices Meet. 1999, 253. 0021-8979
-
Tech. Dig.-Int. Electron Devices Meet.
, vol.1999
, pp. 253
-
-
Wakabyashi, H.1
Saito, Y.2
Takeuchi, K.3
Mogami, T.4
Kunio, T.5
-
3
-
-
0042842595
-
-
0021-8979 10.1063/1.1579550.
-
H. Hu, C. X. Zhu, Y. F. Lu, Y. H. Wu, T. Liew, M. F. Li, B. J. Cho, W. K. Choi, and N. Yakovlev, J. Appl. Phys. 0021-8979 10.1063/1.1579550 94, 551 (2003).
-
(2003)
J. Appl. Phys.
, vol.94
, pp. 551
-
-
Hu, H.1
Zhu, C.X.2
Lu, Y.F.3
Wu, Y.H.4
Liew, T.5
Li, M.F.6
Cho, B.J.7
Choi, W.K.8
Yakovlev, N.9
-
4
-
-
0033745206
-
-
0038-1101 10.1016/S0038-1101(99)00323-8.
-
I. De, D. Johri, A. Srivastava, and C. M. Osburn, Solid-State Electron. 0038-1101 10.1016/S0038-1101(99)00323-8 44, 1077 (2000).
-
(2000)
Solid-State Electron.
, vol.44
, pp. 1077
-
-
De, I.1
Johri, D.2
Srivastava, A.3
Osburn, C.M.4
-
5
-
-
33645217470
-
-
0021-8979 10.1063/1.2178654.
-
M. Kadoshima, A. Ogawa, H. Ota, K. Iwamoto, M. Takahashi, N. Mise, S. Migita, M. Ikeda, H. Satake, T. Nabatame, and A. Toriumi, J. Appl. Phys. 0021-8979 10.1063/1.2178654 99, 054506 (2006).
-
(2006)
J. Appl. Phys.
, vol.99
, pp. 054506
-
-
Kadoshima, M.1
Ogawa, A.2
Ota, H.3
Iwamoto, K.4
Takahashi, M.5
Mise, N.6
Migita, S.7
Ikeda, M.8
Satake, H.9
Nabatame, T.10
Toriumi, A.11
-
6
-
-
33745133713
-
-
0021-8979
-
H. S. Jung, J. H. Lee, S. K. Han, Y. S. Kim, H. J. Lim, M. J. Kim, S. J. Doh, M. Y. Yu, N. I. Lee, H. L. Lee, T. S. Jeon, H. J. Cho, S. B. Kang, S. Y. Kim, I. S. Park, D. Kim, H. S. Baik, and Y. S. Chung, Dig. Tech. Pap.-Symp. VLSI Technol. 2005, 232. 0021-8979
-
Dig. Tech. Pap.-Symp. VLSI Technol.
, vol.2005
, pp. 232
-
-
Jung, H.S.1
Lee, J.H.2
Han, S.K.3
Kim, Y.S.4
Lim, H.J.5
Kim, M.J.6
Doh, S.J.7
Yu, M.Y.8
Lee, N.I.9
Lee, H.L.10
Jeon, T.S.11
Cho, H.J.12
Kang, S.B.13
Kim, S.Y.14
Park, I.S.15
Kim, D.16
Baik, H.S.17
Chung, Y.S.18
-
7
-
-
33646875269
-
-
1369-7021 10.1016/S1369-7021(06)71495-X.
-
B. H. Lee, J. Oh, H. H. Tseng, R. Jammy, and H. Huff, Mater. Today 1369-7021 10.1016/S1369-7021(06)71495-X 9, 32 (2006).
-
(2006)
Mater. Today
, vol.9
, pp. 32
-
-
Lee, B.H.1
Oh, J.2
Tseng, H.H.3
Jammy, R.4
Huff, H.5
-
8
-
-
63749132438
-
-
Extended Abstract of International Workshoon Dielectric Thin Films for Future ULSI Devices: Science and Technology (IWDTF),.
-
K. Akiyama, W. Wang, W. Mizubayashi, K. M. A. Salam, M. Ikeda, H. Ota, T. Nabatame, and A. Toriumi, Extended Abstract of International Workshop on Dielectric Thin Films for Future ULSI Devices: Science and Technology (IWDTF), 2007, p. 63.
-
(2007)
, pp. 63
-
-
Akiyama, K.1
Wang, W.2
Mizubayashi, W.3
Salam, K.M.A.4
Ikeda, M.5
Ota, H.6
Nabatame, T.7
Toriumi, A.8
-
9
-
-
0141649587
-
-
1369-7021
-
C. Hobbs, L. Fonseca, V. Dhandapani, S. Samavedam, B. Taylor, J. Grant, L. Dip, D. Triyoso, R. Hegde, D. Gilmer, R. Garcia, D. Roan, L. Lovejoy, R. Rai, L. Hebert, H. Tseng, B. White, and T. Tobin, Dig. Tech. Pap.-Symp. VLSI Technol. 2003, 9. 1369-7021
-
Dig. Tech. Pap.-Symp. VLSI Technol.
, vol.2003
, pp. 9
-
-
Hobbs, C.1
Fonseca, L.2
Dhandapani, V.3
Samavedam, S.4
Taylor, B.5
Grant, J.6
Dip, L.7
Triyoso, D.8
Hegde, R.9
Gilmer, D.10
Garcia, R.11
Roan, D.12
Lovejoy, L.13
Rai, R.14
Hebert, L.15
Tseng, H.16
White, B.17
Tobin, T.18
-
10
-
-
40949138773
-
-
1369-7021
-
K. Akiyama, W. Wang, W. Mizubayashi, M. Ikeda, H. Ota, T. Nabatame, and A. Toriumi, Dig. Tech. Pap.-Symp. VLSI Technol. 2007, 72. 1369-7021
-
Dig. Tech. Pap.-Symp. VLSI Technol.
, vol.2007
, pp. 72
-
-
Akiyama, K.1
Wang, W.2
Mizubayashi, W.3
Ikeda, M.4
Ota, H.5
Nabatame, T.6
Toriumi, A.7
-
11
-
-
42549171458
-
-
0003-6951 10.1063/1.2903102.
-
W. Wang, K. Akiyama, W. Mizubayashi, T. Nabatame, and A. Toriumi, Appl. Phys. Lett. 0003-6951 10.1063/1.2903102 92, 162901 (2008).
-
(2008)
Appl. Phys. Lett.
, vol.92
, pp. 162901
-
-
Wang, W.1
Akiyama, K.2
Mizubayashi, W.3
Nabatame, T.4
Toriumi, A.5
-
12
-
-
0034454056
-
-
1369-7021
-
D. A. Buchanan, E. P. Gusev, E. Cartier, H. Okorn-Schmidt, K. Rim, M. A. Gribelyuk, A. Mocuta, A. Ajmera, M. Copel, S. Guha, N. Bojarczuk, A. Callegari, C. D'Emic, P. Kozlowski, K. Chan, R. J. Fleming, P. C. Jamison, J. Brown, and R. Arndt, Tech. Dig.-Int. Electron Devices Meet. 2000, 223. 1369-7021
-
Tech. Dig.-Int. Electron Devices Meet.
, vol.2000
, pp. 223
-
-
Buchanan, D.A.1
Gusev, E.P.2
Cartier, E.3
Okorn-Schmidt, H.4
Rim, K.5
Gribelyuk, M.A.6
Mocuta, A.7
Ajmera, A.8
Copel, M.9
Guha, S.10
Bojarczuk, N.11
Callegari, A.12
D'Emic, C.13
Kozlowski, P.14
Chan, K.15
Fleming, R.J.16
Jamison, P.C.17
Brown, J.18
Arndt, R.19
-
13
-
-
63749083737
-
-
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM),.
-
M. Takahashi, H. Satake, M. Kadoshima, A. Ogawa, K. Iwamoto, H. Ota, T. Nabatame, and A. Toriumi, Extended Abstract of International Conference on Solid State Devices and Materials (SSDM), 2006, p. 224.
-
(2006)
, pp. 224
-
-
Takahashi, M.1
Satake, H.2
Kadoshima, M.3
Ogawa, A.4
Iwamoto, K.5
Ota, H.6
Nabatame, T.7
Toriumi, A.8
-
14
-
-
44949245167
-
-
1369-7021
-
K. Iwamoto, A. Ogawa, Y. Kamimuta, Y. Watanabe, W. Mizubayashi, S. Migita, Y. Morita, M. Takahashi, H. Ito, H. Ota, T. Nabatame, and A. Toriumi, Dig. Tech. Pap.-Symp. VLSI Technol. 2007, 70. 1369-7021
-
Dig. Tech. Pap.-Symp. VLSI Technol.
, vol.2007
, pp. 70
-
-
Iwamoto, K.1
Ogawa, A.2
Kamimuta, Y.3
Watanabe, Y.4
Mizubayashi, W.5
Migita, S.6
Morita, Y.7
Takahashi, M.8
Ito, H.9
Ota, H.10
Nabatame, T.11
Toriumi, A.12
|