An analysis of tungsten FIB-Fabricated via resistance

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2008, Pages 133-140

  Niles, David W ^a   Meyer, Jay ^a   Kee, Ronald W ^a   Battista, Michael Di ^b  

^a BROADCOM CORPORATION   (United States)

^b Thermo Fisher Scientific   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT AREAS; EFFECTIVE AREAS; FARADAY CUPS; FLAT SURFACES; HIGH ASPECT RATIOS; LEAST SQUARES FITS; REACTION BYPRODUCTS; VIA RESISTANCES;

ASPECT RATIO; CURVE FITTING; ELECTRODEPOSITION; FABRICATION; FOCUSED ION BEAMS; PHOTORESISTS; QUALITY ASSURANCE; SAFETY FACTOR; SILICON COMPOUNDS; TUNGSTEN;

FAILURE ANALYSIS;

EID: 63549144761     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1361/cp2008istfa133     Document Type: Conference Paper

References (12)

1. Gianuzzi, L. and Stevie, F., Introduction to Focused Ion Beams, Springer (2005).
2. Zaragoza, M. "Reliability Test Results for W FIB interconnect Structures", Integrated Reliability Workshop Final Report, IEEE International (1999), pp. 14-19.
3. Langfischer, H., Basnar, B., Hutler, H., Bertagnolli, "Evolution of tungsten film deposition induced by focused ion beam," J. Vac. Sci. Technol. A20(4), Jul/Aug 2002, pp. 1408-1415.
4. nd International Symposium for Test and Failure Analysis (2006), pp. 67-70.
5. Orloff, J., Swanson, L., and Utlaut, M., High Resolution Focused Ion Beams: FIB and Applications, Kluwer Academic/Plenum Publishers (2003).
6. Iliadis, A.A., Andronescu, S.N., Talyansky, V., Edinger, K., Orloff, J.H., Woods, M.C., and Jones, K.A., Compound Semiconductors, IEEE International Symp, 353 (1997).
7. th Edition, (1996-1997), pg. 12-42.
8. Ray, V., Antoniou, N., Bassom, N., Krechmer, A., and Saxonis, A., J. Vac. Sci. Technol. B21(6), (2003), pp 2715-2719.
9. Liao, M., Koide, Y., and Alvarez, J., J. Vac. Sci. Technol. B24(l), (2006), pp. 185-189.
10. Demarco, A.J., Melngailis, J., J. Vac. Sci. Technol. B 19(6), (2001), pp. 2543-2546.
11. Chen, K.N., Fan, A., Tan, C.S., and Reif, R., Electron Device Letters 25(1), (2004), pp. 10-12.
12. Chen, K. N., Fan, A., Tan, C.S., and Reif, R., Appl. Phys. Lett. 86(1), (2005), pp. 11903-1-3.