Development of void-free focused ion beam-assisted metal deposition process for subhalf-micrometer high aspect ratio vias

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 21, Issue 6, 2003, Pages 2715-2719

  Ray, Valery ^a   Antoniou, Nicholas ^a   Bassom, Neil ^a   Krechmer, Alex ^a   Saxonis, Andrew ^a  

^a Thermo Fisher Scientific   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ASPECT RATIO; DEPOSITION; DIELECTRIC MATERIALS; ELECTRON BEAMS; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); PRESSURE EFFECTS; TUNGSTEN;

LIQUID METAL ION SOURCES (LMIS); VOID FREE DEPOSITION;

ION BEAMS;

EID: 0942289251     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1621666     Document Type: Conference Paper

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