Reliability test results for W FIB interconnect structures

International Integrated Reliability Workshop Final Report

Volumn , Issue , 1999, Pages 14-19

  Zaragoza, Michael ^a   Zhang, Jingwei ^a   Abramo, Marsha ^a  

^a CADENCE DESIGN SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ELECTRIC CURRENTS; ELECTRIC INSULATING MATERIALS; ELECTRIC RESISTANCE; FAILURE ANALYSIS; ION BEAMS; RELIABILITY; SILICA; STRESS ANALYSIS; THERMAL CYCLING; TUNGSTEN;

FOCUSED ION BEAM (FIB) INTERCONNECTS;

INTERCONNECTION NETWORKS;

EID: 0033282165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)