Tensile failure by grain thinning in micromachined aluminum thin films

Journal of Applied Physics

Volumn 93, Issue 3, 2003, Pages 1443-1451

  Lee, Hoo Jeong ^a,b   Zhang, Ping ^a   Bravman, John C ^a  

^a Stanford University   (United States)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; DEFORMATION; DUCTILITY; GRAIN SIZE AND SHAPE; MICROMACHINING; STRAIN; TENSILE TESTING; TRANSMISSION ELECTRON MICROSCOPY;

GRAIN THINNING;

THIN FILMS;

EID: 0037323307     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1532933     Document Type: Article

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