An empirical study on the robust design of a semiconductor-bumping process

Journal of Materials Processing Technology

Volumn 209, Issue 6, 2009, Pages 2986-2993

  Jeang, A ^a   Li, Huan Chung ^b,c  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b Chin Min Institute of Technology 110   (Taiwan)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Computer simulation; Design of experiment (DOE); Empirical model; Optimization; Robust; Semiconductor; Sensitivity analysis

Indexed keywords

COMPUTATIONAL METHODS; DENSITY (OPTICAL); DESIGN OF EXPERIMENTS; DIELECTRIC PROPERTIES; DIFFRACTIVE OPTICAL ELEMENTS; ELECTRIC CONDUCTIVITY; MATHEMATICAL PROGRAMMING; NONVOLATILE STORAGE; PROCESS ENGINEERING; SEMICONDUCTOR MATERIALS; SENSITIVITY ANALYSIS; SOLDERING;

BUMPING PROCESS; DESIGN AND PLANNING; DESIGN OF EXPERIMENT (DOE); EMPIRICAL DATUM; EMPIRICAL MODEL; EMPIRICAL STUDIES; EXPERIMENTAL DATUM; OPTIMIZATION TECHNIQUES; OPTIMUM PARAMETER VALUES; PROBLEM ANALYSIS; PRODUCTION SITES; QUALITY CHARACTERISTICS; QUALITY IMPROVEMENTS; REGRESSION METHODS; ROBUST; ROBUST DESIGNS; ROBUST PARAMETER DESIGNS; SEMI-CONDUCTOR FABRICATIONS; SEMICONDUCTOR; SOLDER BUMPING;

COMPUTER SIMULATION;

EID: 61349176482     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.07.008     Document Type: Article

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