Capacitive micromachined ultrasonic transducers with piston-shaped membranes: Fabrication and experimental characterization

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 56, Issue 1, 2009, Pages 136-145

  Huang, Yongli ^a   Zhuang, Xuefeng ^b   Hæggstrom, Edward O ^c   Ergun, A Sanl ^d   Cheng, Ching Hsiang ^e   Khuri Yakub, Butrus ^b  

^a Kolo Technologies Inc   (United States)

^b STANFORD UNIVERSITY   (United States)

^c UNIVERSITY OF HELSINKI   (Finland)

^d Siemens Corporate Esearch   (United States)

^e HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

A CENTERS; CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS; COMPLEX PROCESSES; DETECTION SENSITIVITIES; DEVICE CAPACITANCES; DEVICE PERFORMANCE; ELECTRODE SEPARATIONS; EXPERIMENTAL CHARACTERIZATIONS; FIRST ORDERS; FRACTIONAL BANDWIDTHS; GEOMETRIC SHAPES; HIGH OUTPUTS; MAXIMUM OUTPUTS; MOVING SURFACES; NEW DEVICES; PERFORMANCE OPTIMIZATIONS; RESONANT FREQUENCIES; SECOND ORDERS; SURFACE DISPLACEMENTS; THICK MEMBRANES; TRANSDUCER SURFACES; TRANSMISSION EFFICIENCIES; YIELD LOSS;

BUTT WELDING; ELECTROACOUSTIC TRANSDUCERS; FLOW OF FLUIDS; MEMBRANES; NATURAL FREQUENCIES; TRANSDUCERS; ULTRASONIC APPLICATIONS; ULTRASONIC EQUIPMENT; ULTRASONIC MEASUREMENT; ULTRASONIC WAVES; ULTRASONICS; WAFER BONDING;

ULTRASONIC TRANSDUCERS;

SILICON;

ARTICLE; ARTIFICIAL MEMBRANE; CHEMISTRY; COMPUTER SIMULATION; ELECTRIC CAPACITANCE; EQUIPMENT DESIGN; INSTRUMENTATION; MICROELECTROMECHANICAL SYSTEM; SENSITIVITY AND SPECIFICITY; TRANSDUCER; ULTRASOUND;

COMPUTER SIMULATION; ELECTRIC CAPACITANCE; EQUIPMENT DESIGN; MEMBRANES, ARTIFICIAL; MICRO-ELECTRICAL-MECHANICAL SYSTEMS; SENSITIVITY AND SPECIFICITY; SILICON; TRANSDUCERS; ULTRASONICS;

EID: 60349121064     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/TUFFC.2009.1013     Document Type: Article

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