Analytical equations for predicting the thermal properties of isotropic conductive adhesives

Journal of Electronic Materials

Volumn 34, Issue 12, 2005, Pages 1586-1590

  Inoue, Masahiro ^a   Sugimura, Takahiro ^a   Yamashita, Munenori ^a   Yamaguchi, Shunro ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Composite theories; Filler; Isotropic conductive adhesives (ICAs); Linear thermal expansion coefficient; Thermal conductivity

Indexed keywords

FILLERS; PARTICLE SIZE ANALYSIS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

COMPOSITE THEORIES; LINEAR THERMAL EXPANSION COEFFICIENT;

ADHESIVES;

EID: 30144437340     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0169-3     Document Type: Conference Paper

References (12)

1. K. Suganuma, MRS Bull. 26, 880 (2001).
2. J. Liu, Conductive Adhesives for Electronics Packaging (Port Erin: Electrochemical Publications, 1999).
3. T. Sugimura, M. Inoue, M. Yamashita, S. Yamaguchi, and K. Suganuma, J. Jpn. Inst. Electron. Packaging 7, 147 (2004) (in Japanese).
4. D.A.G. Bruggeman, Ann. Phys. 24, 636 (1935).
5. R.A. Schapery, J. Composite Mater. 2, 380 (1968).
6. R.E. Meridith and C.W. Tobias, J. Appl. Phys. 31, 1270 (1960).
7. R.E. Meridith and C.W. Tobias, J. Electrochem. Soc. 108, 286 (1961).
8. F.A. Johnson, Atomic Energy Research Establishment R / R 1, 2578 (1958).
9. K. Kanari, Kobunshi 26, 557 (1977) (in Japanese).
10. R.L. Hamilton and O.K. Grosser, Ind. Eng. Chem., Fundam. 1, 187 (1962).
11. Z. Hashin, J. Appl. Mech., Trans. ASME 29, 143 (1962).
12. Z. Hashin and S. Shtrikman, J. Mech. Phys. Solids 11, 127 (1963).