Adsorption and desorption kinetics of a block copolymer wetting agent used in copper electroplating

Journal of the Electrochemical Society

Volumn 156, Issue 3, 2009, Pages

  Willey, Mark J ^a   McInerney, Edward J ^a  

^a Novellus Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BLOCK COPOLYMERS; COPOLYMERIZATION; COPPER; COPPER PLATING; DESORPTION; ELECTROCHEMISTRY; ELECTROPLATING; ETHYLENE GLYCOL; FLUID DYNAMICS; GLYCOLS; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; POLYMERS; RATE CONSTANTS; SURFACE ACTIVE AGENTS; WETTING;

ADSORPTION CHARACTERISTICS; ADSORPTION PROCESS; ADSORPTION RATES; AG-AGCL; APPLIED POTENTIALS; BOTTOM-UP FILLS; COPPER ELECTROPLATING; DESORPTION CHARACTERISTICS; DESORPTION KINETICS; DYNAMIC MODELING; FLOW-THROUGH CELLS; FREE ENTRIES; PLATING BATHS; POLYMER BULKS; SATURATED SURFACES; SURFACE SUPPRESSIONS; TWO STAGES; WETTING AGENTS;

ADSORPTION;

EID: 59349099757     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3058600     Document Type: Article

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