The thermal design of a next generation data center: A conceptual exposition

Journal of Electronic Packaging

Volumn 130, Issue 4, 2008, Pages 0411041-0411048

  Samadiani, Emad ^a   Joshi, Yogendra ^a   Mistree, Farrokh ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; ELECTRONIC COOLING; ELECTRONIC EQUIPMENT; HEAT FLUX; HEATING; THERMOELECTRIC EQUIPMENT;

'CURRENT; DATACENTER; HEAT GENERATION RATE; NEW SOLUTIONS; NEXT GENERATION DATA CENTERS; PERFORMANCE; POWER; THERMAL DESIGNS; THERMAL SOLUTION; VOLUMETRIC HEAT GENERATION;

SPECIFICATIONS;

EID: 58149216452     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2993151     Document Type: Conference Paper

References (39)

1. Patel, C. D., Sharma, R., Bash, C., and Beitelmal, M., 2002, "Thermal Considerations in Cooling of Large Scale High Compute Density Data Centers," Eight Intersociety Conference on Thermal and Thermomechanica] Phenomena in Electronic Systems (ITHERM 2002), San Diego, CA.
2. Rambo, J., arid Joshi, Y., "Multi-Scale Modeling of High Power Density Data Centers," The Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition (InterPACK03), Kauai. HI, Paper No. InterPack2003-35297.
3. Rambo, J., and Joshi, Y., 2003, "Physical Models in Data Center Airflow Simulations," ASME International Mechanical Engineering Congress and R&D Exposition (IMECE-03), Washington, DC, Paper No. 1MECE03-41381.
4. Shrivastava, S., Sammakia, B., Schmidt, R., and Iyengar, M., 2005, "Comparative Analysis of Different Data Center Airflow Management Configurations," ASME InterPACK, San Francisco, CA, ASME, New York, Paper No. 1PACK2005-73234.
5. Iyengar, M., Schmidt, R., Sharma, A., McVicker, O., Shrivastava, S., Sri-Jayantha, S.., Amemiya, Y., Dang, H., Chainer,' T., and Sammakia, B., 2005, "Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling," ASME InterPACK, San Francisco, CA, ASME, New York, Paper No. IPACK2005-73387.
6. Schmidt, R., Karki, K. C., and Patankar, S. V., 2004, "Raised-Floor Data Center: Perforated Tile Flow Rates for Various Tile Layouts," Ninth Intersoci- ety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2004), Las Vegas, NV.
7. VanGilder, J. W., and Schmidt, R., 2005, "Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center," ASME InterPACK, San Francisco, CA, ASME, New York, Paper No. IPACK2005-73375.
8. Shah, A., Carey, V., Bash, C., and Patel, C., 2005, "Energy-Based Optimization Strategies for Multi-Component Data Center Thermal Management: Part I, Analysis," ASME InterPACK, San Francisco, CA, ASME, New York, Paper No. IPACK2005-73137.
9. Shah, A., Carey, V., Bash, C., and Patel, C., 2005, "Energy-Based Optimization Strategies for Multi-Component Data Center Thermal Management: Part II, Application and Validation," ASME InterPACK, San Francisco, CA, ASME, New York, Paper No. IPACK2005-73138.
10. Bhopte, S., Agonafer, D., Schmidt, R., and Sammakia, B., 2005, "Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature," ASME InterPACK, San Francisco, CA, ASME, New York, Paper No. IPACK20O5-73027.
11. Schmit, R., and Iyengar, M., 2005, "Effect of Data Center Layout on Rack Inlet Air Temperatures," ASME InterPACK, San Francisco, CA, ASME, New York, Paper No. IPACK2005-73385.
12. Sharma, R. K., Bash, C. E., and Patel, C. D., 2002, "Dimensionless Parameters for the Evaluation of Thermal Design and Performance of Large-Scale Data Centers," AIAA Paper No. 2002-3091.
13. Rang, S., Schmidt, R., Kelkar, K. M., Radmehr, A., and Patankar, S. V., 2000, "A Methodology for the Design of Perforated Tiles in a Raised Floor Data Center Using Computational Flow Analysis," Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2000), Las Vegas, NV.
14. Boucher, T. D., Auslander, D. M., Bash, C. E., Federspiel, C. C., and Patel, C. D., 2004, "Viability of Dynamic Cooling Control in a Data Center Environment," Inter Society Conference on Thermal Phenomena, IEEE, New York.
15. Rolander, N., Rambo, J., Joshi, Y., Mistree, F., and Allen, I. K., 2006, "Robust Design of Turbulent Convective Systems Using the Proper Orthogonal Decomposition," ASME J. Mech. Des., Special Issue Robust and Risk Based Design, 128(4), pp. 844-855.
16. Crippen, M. J., Alo, R. K., Champion, D., Clemo, R. M., Grosser, C. M., Gruendler, N. J., Mansuria, M. S., Matteson, J. A., Miller, M. S., and Trumbo, B. A., 2005, "BladeCenter Packaging, Power, and Cooling," IBM J. Res. Dev., 49(6), pp. 887-904.
17. ASHRAE, 2005, Datacom Equipment Power Trends and Cooling Applications, American Society of Heating, Refrigeration and Air-Conditioning Engineers, Atlanta, GA.
18. IBM, http://ibm.com/eserver/xseries/storage/rack.html.
19. Liebert Corporation, http://www.liebert.com/dynamic/displayproduct.asp7id = 1077&cycles=60hz.
20. APC (American Power Conversion) Corporation, http://www.apc.com.
21. Thermacore International Inc., http://www.thermacore.com/default.asp.
22. Heydari, A., and Sabounchi, P., 2004, "Refrigeration Assisted Spot Cooling of a High Heat Density Data Center," Inter Society Conference of Thermal Phenomena, IEEE, New York.
23. Schmidt, R., Chu, R., Ellsworth, M., Iyengar, M., Porter, D., Kamath, V., and Lehman, B., 2005, "Maintaining Datacom Rack Inlet Temperatures With Water Cooled Heat Exchanger," ASME InterPACK, San Francisco, CA, ASME, New York, Paper No. IPACK2005-73468.
24. Wang, D., 2004, "A Passive Solution to a Difficult Data Center Environmental Problem," Inter Society Conference on Thermal Phenomena, IEEE, New York.
25. Beaty, D., and Schmidt, R. R., 2004, "Back to the Future: Liquid Cooling Data Center Consideration," ASHRAE J., 46(12), pp. 42-47.
26. Gurram, S., Suman, S., Joshi, Y., and Fedorov, A., 2003, "Thermal Issues in Next Generation Integrated Circuits," International Electronic Packaging Technical Conference and Exhibition (IPACK03), Maui, HI, ASME, New York.
27. Simpson, T. W., Lautenschlager, U., and Mistree, F., 1998, 'Towards Mass Customization in the Age of Information: The Case for Open Engineering Systems," The Information Revolution: Present and Future, W. Read and A. Porter, eds., Ablex, Westport, CT, pp. 49-71.
28. Zuo, Z. J., Hoover, L. R., and Phillips, A. L., 2002, "An Integrated Thermal Architecture for Thermal Management of High Power Electronics," Thermal Challenges in Next Generation Electronic Systems, Y. Joshi and S. Garimella, eds., Millpress, Rotterdam.
29. http://www.hds.com/solutions/storage-strategies/eco-fhendly.html.
30. Joshi, Y., and Wei, X.-J., 2007, "Micro and Meso Scale Compact Heat Exchangers in Electronics Thermal Management-Review," International J. Heat Exchangers (Invited Paper), Special Supplemental Issue on Advances in Com pact Heat Exchangers, pp. 1-32.
31. Amon, C. H., Yao, S.-C., Wu, C.-F., and Hsieh, C.-C., 2005, "Microelectro-mechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics," ASME J. Heat Transfer, 127, pp. 66-75.
32. Williams, Z. A., and Roux, J. A., 2006, "Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers," Ninth AIAA/ASME Joint Thermophysics and Heat Transfer Conference, San Francisco, CA, Jun. 5-8, AIAA Paper No. 2006-3609.
33. Coggins, C., Gerlach, D., Joshi, Y., and Federov, A., 2006, "Compact Low Temperature Refrigeration of Microprocessors," Proceedings of the International Refrigeration and Air Conditioning Conference at Purdue University, Purdue, IN.
34. Karki, K. C., Patankar, S. V., and Radmehr, A., 2003, Techniques for Controlling Airflow Distribution in Raised-Floor Data Centers, American Society of Mechanical Engineers, New York.
35. Fried, E., and Idelchik, I. E., 1989, Flow Resistance: A Design Guide for Engineers, Hemisphere, New York.
36. 2001, fluent, Version 6.1, User's Manual, Fluent Incorporated, Lebanon, NH.
37. Rambo, J., and Joshi, Y., 2006, "Thermal Modeling of Technology Infrastructure Facilities: A Case Study of Data Centers," The Handbook of Numerical Heat Transfer, W. J. Minkowycz, E. M. Sparrow, and J. Y. Murthy, eds., Taylor & Francis, New York.
38. Belytschko, T., Fish, J., Hughes, T. J. R., and Oden, J. T., 2004, Simulation Based Engineering Science, A Report on a Workshop Held Under the Auspices of the National Science Foundation, Arlington, VA.
39. Panchal, J. H., 2005, "A Framework for Simulation-Based Integrated Design of Multiscale Products and Design Processes," Ph.D. dissertation, G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA.