Analysis of the test parameters in the shear test of BGA solder joints

Key Engineering Materials

Volumn 297-300 II, Issue , 2005, Pages 851-856

  Kim, Jong Woong ^a   Park, Sun Kyu ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

BGA; Finite element analysis; Pb free solder; Shear height; Shear test

Indexed keywords

CHEMICAL BONDS; FINITE ELEMENT METHOD; SHEAR STRESS; SOLDERING ALLOYS;

BGA; PB FREE SOLDERS; SHEAR HEIGHT; SHEAR TESTS;

SOLDERED JOINTS;

EID: 34249665979     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-978-4.851     Document Type: Conference Paper

References (8)

1. B. Pahl, C. Kallmayer, R. Aschenbrenner and H. Reichl: Microelectronics Reliability Vol. 44 (2004), p. 309
2. K.S. Kim, C.H. Yu and J.M. Yang: Thin Solid Films Vol. 462 (2004), p. 402
3. J. Wang, H.K. Lim, H.S. Lew, W.T. Saw and C.H. Tan: Microelectronics Reliability Vol. 44 (2004), p. 833
4. J.W. Kim and S.B. Jung: Materials Science and Engineering A Vol. 371 (2004), p. 267
5. J.W. Kim, J.W. Yoon and S.B. Jung: Materials Science Forum Vol. 449 (2004), p. 897
6. J.W. Yoon, S.W. Kim and S.B. Jung: Materials Transactions Vol. 45 (2004), p. 727
7. K.N. Chiang and C.A. Yuan: IEEE Transactions on Advanced Packaging Vol. 24 (2001), p. 158
8. H.T. Lee and T.L. Liao: Materials Science and Engineering A Vol. 358 (2003), p. 134