Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 4, 2001, Pages 691-697

  Chen, Chun Jen ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Diffusion barrier; Electroless nickel; Flip chip; Intermetallic; Solder bump

Indexed keywords

CRYSTALLIZATION; DIFFUSION; ELECTROLESS PLATING; INTERMETALLICS; NICKEL COMPOUNDS; SOLDERING ALLOYS; SURFACE CHEMISTRY; TIN ALLOYS;

DIFFUSION BARRIERS;

FLIP CHIP DEVICES;

EID: 0035696899     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.974962     Document Type: Article

References (32)

1. Fast dissolution and soldering reactions on Au foils
2. Morphology of wetting reaction of eutectic SnPb Solder on Au foils
3. Interracial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
4. Rapid formation of intermetallic compounds by interdiffusion in the Cu-Sn and Ni-Sn systems
5. Area array solder interconnections for VLSI
6. Reliability improvements in solder bump processing for flip chips
7. Solder bump fabrication by electroplating for flip-chip applications
8. Thermal stability of various ball-limited-metal systems under solder bumps
9. Application of electroless nickel plating in the semiconductor microcircuit industry
10. Shearing strength and materials interaction during reflow of Al/Cu/electroless nickel/solder bump
11. Solder joint reliability of plastic ball grid array packages
12. The interactions between In-Sn solders and an electroless Ni-P deposit upon heat treatment
13. The interaction kinetics and compound formation between electroless Ni-P and solder
14. Solderability of electroless nickel alloys using wetting balance technique
15. Resistance characteristics of electroless Ni-Cu-P alloy films
16. Electroless deposition of Ni-Cu-P alloys in acidic solutions
17. Deposition and crystallization behaviors of electroless Ni-Cu-P deposits
18. Thermal stability of Ni-P and Ni-Cu-P amorphous alloys
19. Effect of annealing on magnetic properties and microstructure of electroless nickel-copper-phosphorus alloy deposits
20. Structure and corrosion resistance of electroless Ni-Cu-P
21. Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum
22. The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow
23. Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology
24. Wetting kinetics and the interaction behavior between electroless Ni-Cu-P and molten solder
25. Ni-Cu-P and Ni-Co-P as a diffusion barrier between an Al pad and a solder hump
26. Thermal stability of electroless-nickel/solder interface: Part A. Interracial chemistry and microstructure