Thermal-aware reliability analysis for platform FPGAs

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

Volumn , Issue , 2008, Pages 722-727

  Mangalagiri, Prasanth ^a   Bae, Sungmin ^a   Krishnan, Ramakrishnan ^a   Xie, Yuan ^a   Narayanan, Vijaykrishnan ^a  

^a The Pennsylvania State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FEATURE SIZES; LIFETIME RELIABILITIES; NEGATIVE BIAS TEMPERATURE INSTABILITIES; ON CHIPS; PERFORMANCE DEGRADATIONS; RING OSCILLATORS; TEMPERATURE DEPENDENTS; TEMPERATURE VARIATIONS;

COMPUTER AIDED DESIGN; DIELECTRIC MATERIALS; FIELD EFFECT TRANSISTORS; FIELD PROGRAMMABLE GATE ARRAYS (FPGA); MOSFET DEVICES; NEGATIVE TEMPERATURE COEFFICIENT; QUALITY ASSURANCE; RELIABILITY ANALYSIS; TEMPERATURE MEASUREMENT; THERMODYNAMIC STABILITY;

RELIABILITY;

EID: 57849146681     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCAD.2008.4681656     Document Type: Conference Paper

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