Thermal characterization and optimization in platform FPGAs

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

Volumn , Issue , 2006, Pages 443-447

  Sundararajan, Priya ^a   Gayasen, Aman ^a   Vijaykrishnan, N ^a   Tuan, T ^a  

^a NONE

Author keywords

Placement; Platform FPGAs; Temperature; Thermal; Virtex4

Indexed keywords

DESIGN; DIES; FABRICS; FIELD PROGRAMMABLE GATE ARRAYS (FPGA); THERMOANALYSIS;

COMPUTER-AIDED DESIGN; DIE TEMPERATURE (DT); FPGA FABRIC; HARD BLOCKS; HIGH SPEED TRANSCEIVERS; IN-FIELD; INTERNATIONAL CONFERENCES; PEAK TEMPERATURES; POWER DENSITY (PD); TEMPERATURE PROFILING; VIRTEX 4;

TEMPERATURE;

EID: 46149089208     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCAD.2006.320154     Document Type: Conference Paper

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