Characterization of chemical vapor deposited copper films on mercaptan self-assembled monolayer diffusion barriers

Chemical Vapor Deposition

Volumn 12, Issue 11, 2006, Pages 679-684

  Liu, Xin ^a   Wang, Qi ^a   Wu, Song ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Copper films; Diffusion barrier; Self assembled monolayers

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER PLATING; DIFFUSION; DIFFUSION BARRIERS; ELECTRON ENERGY LEVELS; FILM GROWTH; METALLIC FILMS; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; MONOLAYERS; ORGANIC POLYMERS; PHOTOELECTRON SPECTROSCOPY; SELF ASSEMBLED MONOLAYERS; SEMICONDUCTOR DOPING; SILANES; SUBSTRATES; THICK FILMS; THIN FILMS; X RAY ANALYSIS; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMICAL VAPOR DEPOSITED; COPPER FILMS; COPPER THIN FILMS; FILM DEPOSITIONS; FILM RESISTIVITIES; MERCAPTOPROPYLTRIMETHOXYSILANE; MODIFIED SUBSTRATES; MULTILEVEL METALLIZATION; POTENTIAL TECHNIQUES; PROBE METHODS; SUBSTRATE TEMPERATURES; SURFACE ANALYSIS TECHNIQUES; TEMPERATURE RANGES; X-RAY DIFFRACTIONS; X-RAY PHOTOELECTRON SPECTROSCOPIES;

COPPER;

EID: 54949151494     PISSN: 09481907     EISSN: 15213862     Source Type: Journal    
DOI: 10.1002/cvde.200606488     Document Type: Article

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