Wettability studies of Pb-free soldering materials

International Journal of Thermophysics

Volumn 29, Issue 6, 2008, Pages 1974-1986

  Moser, Z ^a   Gasior W ^a   Pstrus J ^a   Debski A ^a  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

Author keywords

Industrial applications; Interfacial tension; Modeling of Pb free solders; Surface tension

Indexed keywords

ANTIMONY ALLOYS; BINARY ALLOYS; BINARY MIXTURES; BISMUTH ALLOYS; COPPER ALLOYS; EUTECTICS; INDUSTRIAL APPLICATIONS; LEAD ALLOYS; MELTING POINT; SILVER ALLOYS; SOLDERING; SOLIDIFICATION; SURFACE TENSION; TERNARY ALLOYS; TIN ALLOYS; WETTING;

ENTHALPIES OF FORMATION; EXCESS GIBBS ENERGY; MEASUREMENTS OF; SOLDERING MATERIALS; SOLDERING TEMPERATURE; SOLUTION CALORIMETRY; THERMODYNAMIC MODEL; THERMODYNAMIC PARAMETER;

LEAD-FREE SOLDERS;

EID: 57749202300     PISSN: 0195928X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10765-007-0363-z     Document Type: Article

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