Pb-free solders: Part III. Wettability testing of Sn-Ag-Cu-Bi alloys with Sb additions

Journal of Phase Equilibria and Diffusion

Volumn 28, Issue 5, 2007, Pages 433-438

  Moser, Z ^a   Gasior, W ^a   Bukat, K ^b   Pstrus J ^a   Kisiel, R ^c   Sitek, J ^b   Ishida, K ^d   Ohnuma, I ^d  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^b TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^c WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^d TOHOKU UNIVERSITY   (Japan)

Author keywords

Density; Meniscographic studies; Pb free solders; Surface tension

Indexed keywords

MENISCOGRAPHIC STUDIES; PB-FREE SOLDERS; PROTECTIVE ATMOSPHERE; PROTECTIVE FLUX;

CONTACT ANGLE; EUTECTICS; SURFACE TENSION; TIN ALLOYS; WETTING;

SOLDERING ALLOYS;

EID: 35348951057     PISSN: 15477037     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11669-007-9156-0     Document Type: Article

References (11)

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