Surface tension and density measurements of Sn-Ag-Sb liquid alloys and phase diagram calculations of the Sn-Ag-Sb ternary system

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 652-660

  Moser, Zbigniew ^a   Ga̧sior, Wladysław ^a   Pstruś, Janusz ^a   Ishihara, Satoru ^b   Liu, Xing Jun ^c   Ohnuma, Ikuo ^c   Kainuma, Ryosuke ^c   Ishida, Kiyohito ^c  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^b R&D Institute of Metals and Composites for Future Industries   (Japan)

^c TOHOKU UNIVERSITY   (Japan)

Author keywords

Calphad; Lead free solder; Microsoldering; Thermodynamics

Indexed keywords

ANTIMONY; BUBBLES (IN FLUIDS); DENSITY MEASUREMENT (SPECIFIC GRAVITY); MOLTEN MATERIALS; OPTIMIZATION; PHASE DIAGRAMS; PRESSURE EFFECTS; SILVER; SOLIDIFICATION; SURFACE TENSION; THERMODYNAMICS;

BUBBLE PRESSURE METHOD; CALPHAD; LEAD-FREE SOLDERS; MICROSOLDERING;

TIN;

EID: 2442484726     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.652     Document Type: Article

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