Pb-free solders: Part II. Application of ADAMIS database in modeling of Sn-Ag-Cu alloys with Bi additions

Journal of Phase Equilibria and Diffusion

Volumn 27, Issue 3, 2006, Pages 245-254

  Ohnuma, I ^a   Ishida, K ^a   Moser, Z ^b   Gasior W ^b   Bukat, K ^c   Pstrus J ^b   Kisiel, R ^d   Sitek, J ^c  

^a TOHOKU UNIVERSITY   (Japan)

^b INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^c TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^d WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Phase equilibria; Simulation of solidification; Sn Ag Cu Bi; Surface tension

Indexed keywords

BISMUTH; DATABASE SYSTEMS; PHASE EQUILIBRIA; PRESSURE MEASUREMENT; SOLIDIFICATION; SURFACE TENSION; TERNARY SYSTEMS;

LIFTING-OFF FAILURE; SEGREGATION; SIMULATION OF SOLIDIFICATION; SN-AG-CU-BI;

SOLDERING ALLOYS;

EID: 33745368194     PISSN: 15477037     EISSN: None     Source Type: Journal    
DOI: 10.1361/154770306X109791     Document Type: Article

References (21)

1. Z. Moser, W. Ga̧sior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, K. Ishida and I. Ohnuma, Pb-Free Solders: Part I. Wettability Testing of Sn-Ag-Cu Alloys with Bi Additions, J. Phase Equilib. Diffus., 2006, 27(2), p 133-139
2. J.A.V. Butler, The Thermodynamics of the Surfaces of Solutions, Proc. R. Soc. London, 1932, 85, p 347-375
3. Z. Moser, W. Ga̧sior, and J. Pstruś, Surface Tension of Liquid Ag-Sn Alloys: Experiment versus Modeling, J. Phase Equilib, 2001, 22(3), p 254-258
4. eut + Cu Soldering Materials, Part I. Wettability Studies, J. Phase Equilib. Diffusion, 2004, 25(2), p 115-121
5. I. Ohnuma, X.J. Liu, H. Ohtani, and K. Ishida, Thermodynamic Database for Phase Diagrams in Micro-Soldering Alloys, J. Electron. Mater., 1998, 28, p 1164-1171
6. W. Ga̧sior, Z. Moser, J. Pstruś, B. Krzyżak, and K. Fitzner, Surface Tension and Thermodynamic Properties of the Ag-Bi Solutions, J. Phase Equilib., 2003, 24(1), p 40-49
7. Z. Moser, W. Ga̧sior, J. Pstruś, W. Zakulski, I. Ohnuma, X.J. Liu, Y. Inohana, and K. Ishida, Studies of the Ag-In Phase Diagram and Surface Tension Measurements, J. Electron. Mater., 2001, 30, p 1120-1128
8. Z. Moser, W. Ga̧sior, and J. Pstruś, Surface Tension Measurements of the Sn-Bi and Sn-Bi-Ag Liquid Alloys, J. Electron. Mater., 2001, 30, p 1104-1111
9. W. Ga̧sior, Z. Moser, and J. Pstruś, Density and Surface Tension of the Pb-Sn Liquid Alloys, J. Phase Equilib., 2001, 22(1), p 20-25
10. W. Ga̧sior, Z. Moser, and J. Pstruś, Surface Tension, Density, and Molar Volume of Liquid Sb-Sn Alloys: Experiment versus Modeling, J. Phase Equilib., 2003, 24(6), p 504-510
11. W. Ga̧sior, Z. Moser, J. Pstruś, K. Ishida, and I. Ohnuma, Surface Tension and Density of (Ag-Sn)eut + Sb Liquid Alloys, Mater. Trans., 2004, 45, p 652-660
12. X.J. Liu, Y. Inohana, I. Ohnuma, R. Kainuma, K. Ishida, Z. Moser, W. Ga̧sior, and J. Pstruś, Experimental Determination and Thermodynamic Calculation of the Phase Equilibria and Surface Tension of the Ag-Sn-In System, J. Electron. Mater., 2002, 31, p 1139-1151
13. I. Ohnuma, M. Miyashita, K. Anzai, X.J. Liu, H. Ohtani, and K. Ishida, Phase Equilibria and the Related Properties of Sn-Ag-Cu Based Pb-Free Solder Alloys, J. Electron. Mater., 2000, 20, p 1137-1142
14. E. Scheil, Über die Eutektische Kristallisation (On Eutectic Crystallization), Z. Metallkd, 1942, 34, p 70-80, in German
15. J.S. Hwang, Lead-Free Implementation and Production. A Manufacturing Guide, McGraw-Hill, 2005
16. H. Takao and H. Hasegawa, Influence of Alloy Composition on Fillet-Lifting Phenomenon in Sn-Ag-Bi Alloys, J. Electron. Mater., 2001, 30, p 1060-1067
17. Z. Moser, W. Ga̧sior, and J. Pstruś, Lead-Free Soldering Materials, Inżynieria Materiałowa, 2002, 2, p 65-68
18. Z. Moser, W. Ga̧sior, and A. Dȩbski, Database Pb-free Soldering Material, Surface Tension and Density, Experiment vs. Modeling, Data Sci. J., 2005, 4, p 195-208
19. M. Miyazaki, M. Mitutani, T. Takemoto, and A. Matsunawa, Conditions for Measurement of Surface Tension of Solders with a Wetting Balance Tester, Trans. JWRI, 1997, 26, p 81-84
20. E.P. Lopez, P.T. Vianco, and I.A. Rejent, Solderability Testing of Sn-Ag-XCu Pb-Free Solders on Copper and Au-Ni Plated Kovar Substrates, J. Electron. Mater., 2005, 34, p 299-310
21. Z. Moser, W. Ga̧sior, K. Ishida, I. Ohnuma, X.J. Liu, K. Bukat, J. Pstruś, J. Sitek, and R. Kisiel, Experimental Wettability Studies Combined with the Related Properties from Database for Tin Based Alloys with Silver, Copper, Bismuth, and Antimony Additions, 134th Annual Meeting & Exhibition, Book of Final Program, February 13-17, 2005 (San Francisco, CA), TMS, Warrendale, PA, 2005.