Separation of composite defect patterns on wafer bin map using support vector clustering

Expert Systems with Applications

Volumn 36, Issue 2 PART 1, 2009, Pages 2554-2561

  Wang, Chih Hsuan ^a  

^a MING CHUAN UNIVERSITY   (Taiwan)

Author keywords

Data mining; Defect pattern; Kernel decomposition; Support vector clustering; Wafer binary map

Indexed keywords

DATA MINING; INVESTMENTS; SEPARATION; SILICON WAFERS;

DEFECT PATTERNS; EIGEN DECOMPOSITION; KERNEL DECOMPOSITION; MANUFACTURING COST; SEMI-CONDUCTOR WAFER; SPATIAL STATISTICS; SUPPORT VECTOR CLUSTERING; WAFER BINARY MAP;

DEFECTS;

EID: 56649124420     PISSN: 09574174     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eswa.2008.01.057     Document Type: Article

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