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Volumn 39, Issue 3, 1997, Pages 241-253

Monitoring wafer map data from integrated circuit fabrication processes for spatially clustered defects

Author keywords

Join count statistic; Markov random field; Quality improvement; Spatial randomness; Statistical process control

Indexed keywords

DEFECTS; INTEGRATED CIRCUIT MANUFACTURE; MARKOV PROCESSES; MONITORING; QUALITY CONTROL;

EID: 0031200533     PISSN: 00401706     EISSN: 15372723     Source Type: Journal    
DOI: 10.1080/00401706.1997.10485116     Document Type: Article
Times cited : (103)

References (16)
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  • 2
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  • 8
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    • Friedman, D.J.1    Hansen, M.H.2    Hoyer, J.R.3    Nair, V.N.4
  • 10
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    • Hansen, M. H., and Nair V. N. (1995), “Process and Productivity Improvement in Semiconductor Manufacturing,” inComputing Science and Statistics(27), eds. M. Meyer, and J. Rosenberger, Fairfax Station, VA: Interface Foundation of North America, pp. 3-7.
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    • Hansen, M.H.1    Nair, V.N.2
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    • Clustering on Coloured Lattices
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  • 16
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    • Detecting Spatial Effects From Factorial Experiments: An Application in Integrated Circuit Manufacturing
    • Taam, W., and Hamada, M. (1993), “Detecting Spatial Effects From Factorial Experiments: An Application in Integrated Circuit Manufacturing,”Technometrics,35, 149-160
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.