Detection and classification of defect patterns on semiconductor wafers

IIE Transactions (Institute of Industrial Engineers)

Volumn 38, Issue 12, 2006, Pages 1059-1068

  Wang, Chih Hsuan ^a   Kuo, Way ^b   Bensmail, Halima ^c  

^a MING CHUAN UNIVERSITY   (Taiwan)

^b University of Tennessee Knoxville   (United States)

^c UNIVERSITY OF TENNESSEE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; DEFECTS; PRODUCTION ENGINEERING; QUALITY ASSURANCE; QUALITY CONTROL; SCANNING ELECTRON MICROSCOPY;

DEFECT PATTERNS; QUALITY ENGINEERING; SEMICONDUCTOR WAFERS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 33750132385     PISSN: 0740817X     EISSN: 15458830     Source Type: Journal    
DOI: 10.1080/07408170600733236     Document Type: Article

References (25)

1. Bensmail, H. and Celeux, G. (1996) Regularized Gaussian discriminant analysis through eigenvalue decomposition Journal of the American Statistical Association, 91, pp. 1743-1748. http://www.csa.com/htbin/ linkabst.cgi?issn=0162-1459&vol=91&iss=&firstpage=1743 [CSA]
2. Bensmail, H. and Raftery and Celeux, A. and Robert, C. (1997) Inference in model-based cluster analysis Journal of Computing and Statistics, 7, pp. 1-10. http://dx.doi.org/10.1023%2FA%3A1018510926151 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=&vol=7&iss= &firstpage=1 [CSA]
3. Chen, F. and Liu, S. (2000) A neural-network approach to recognize defect spatial pattern in semiconductor fabrication IEEE Transactions on Semiconductor Manufacturing, 13, pp. 366-372. http://dx.doi.org/ 10.1109%2F66.857947 [CROSSREF] http://www.csa.com/htbin/ inkabst.cgi?issn=0894-6507&vol=13&iss=&firstpage=366 [CSA]
4. Chou, P. and Rao, A. and Sturenbecker, M. and Wu, F. and Brecher, V. (1997) Automatic defect classification for semiconductor manufacturing Machine Vision and Applications, 9, pp. 201-214. http://dx.doi.org/ 10.1007%2Fs001380050041 [CROSSREF] http://www.csa.com/htbin/ linkabst.cgi?issn=0932-8092&vol=9&iss=&firstpage=201 [CSA]
5. Cunningham, J. (1990) The use and evaluation of yield models in integrated circuit manufacturing IEEE Transactions on Semiconductor Manufacturing, 3, pp. 60-71. http://dx.doi.org/10.1109%2F66.53188 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=0894-6507&vol= 3&iss=&firstpage=60 [CSA]
6. Cunningham, S. and MacKinnon, S. (1998) Statistical methods for visual defect metrology IEEE Transactions on Semiconductor Manufacturing, 11, pp. 48-53. http://dx.doi.org/10.1109%2F66.661284 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=0894-6507&vol=11&iss= &firstpage=48 [CSA]
7. Dave, R. (1992) Generalized fuzzy c-shells clustering and detection of circular and elliptical boundaries Pattern Recognition, 25, pp. 713-721. http://dx.doi.org/10.1016%2F0031-3203%2892%2990134-5 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=0167-8655&vol=25&iss= &firstpage=713 [CSA]
8. Duda, R. and Hart, P. and Stork, D. (2000) Pattern Classification, 2nd edn. New York NY: Wiley.
9. Ferris-Prabhu, A. (1990) A cluster-modified Poisson model for estimating defect density and yield IEEE Transactions on Semiconductor Manufacturing, 3, pp. 54-59. http://dx.doi.org/10.1109%2F66.53187 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=0894-6507&vol= 3&iss=&firstpage=54 [CSA]
10. Friedman, D. and Albin, S. (1991) Clustered defects in IC fabrication: impact on process control charts IEEE Transactions on Semiconductor Manufacturing, 4, pp. 36-42. http://dx.doi.org/10.1109%2F66.75850 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=0894-6507&vol= 4&iss=&firstpage=36 [CSA]
11. Friedman, D. and Hansen, V. and David, A. (1997) Model-free estimation of defect clustering in integrated circuit fabrication IEEE Transactions on Semiconductor Manufacturing, 10, pp. 344-359. http://dx.doi.org/ 10.1109%2F66.618208 [CROSSREF] http://www.csa.com/htbin/ linkabst.cgi?issn=0894-6507&vol=10&iss=&firstpage=344 [CSA]
12. Gonalez, R. and Woods, R. (2001) Digital Image Processing, 2nd edn. Prentice-Hall.
13. Halkdi, M. and Batistakis, Y. and Vazirgannis, M. (2001) On clustering validation techniques Journal of Intelligent Systems, 17, pp. 107-145. http://dx.doi.org/10.1023%2FA%3A1012801612483 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=1027-1015&vol=17&iss= &firstpage=107 [CSA]
14. Hansen, M. and Friedman, D. and Nair, V. (1997) Monitoring wafer map data from integrated circuit fabrication process for spatially clustered defects Technometrics 39 (3), pp. 241-253. http://dx.doi.org/ 10.2307%2F1271129 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn= 0040-1706&vol=39&iss=3&firstpage=241 [CSA]
15. Johnson, R. and Wichern, D. (2002) Applied Multivariate Statistical Analysis, 5th edn. Upper Saddle River NJ: Prentice-Hall.
16. Jun, C. and Hong, Y. and Kim, S. and Park, K. and Park, H. (1999) A simulation-based semiconductor chip yield model incorporating a new defect cluster index Microelectronics Reliability, 39, pp. 451-456. http://dx.doi.org/10.1016%2FS0026-2714%2899%2900026-8 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=0026-2714&vol=39&iss= &firstpage=451 [CSA]
17. Kass, R. and Raftery, A. (1995) Bayes factors Journal of the American Statistical Association, 90, pp. 773-795. http://dx.doi.org/ 10.2307%2F2291091 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn= 0162-1459&vol=90&iss=&firstpage=773 [CSA]
18. Krishnapuram, R. and Freg, C. (1992) Fitting an unknown number of lines and planes to image data through compatible cluster merging Pattern Recognition, 25(4), pp. 385-400. http://dx.doi.org/ 10.1016%2F0031-3203%2892%2990087-Y [CROSSREF] http://www.csa.com/htbin/ linkabst.cgi?issn=0167-8655&vol=25&iss=4&firstpage=385 [CSA]
19. Krishnapuram, R. and Nasraoui, O. and Frigui, H. (1992) The fuzzy C spherical shells algorithm: A new approach IEEE Transactions on Neural Networks, 3, pp. 663-671. http://dx.doi.org/10.1109%2F72.159056 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=1045-9227&vol= 3&iss=&firstpage=663 [CSA]
20. Kuo, W. and Chien, K. and Kim, T. (1998) Reliability, Yield, and Stress Burn-in: A Unified Approach for Microelectronics Systems and Manufacturing and Software Development. Boston MA: Kluwer.
21. Kuo, W. and Kim, T. (1999) An overview of manufacturing yield and reliability modeling for semiconductor products Proceedings of the IEEE, 87(7), pp. 1329-1346. http://dx.doi.org/10.1109%2F5.775417 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=1051-0117&vol=87&iss= 7&firstpage=1329 [CSA]
22. Liu, S. and Chen, F. and Lu, W. (2002) Wafer bin map recognition using a neural network approach International Journal of Production Research, 40, pp. 2207-2223. http://dx.doi.org/10.1080%2F00207540210122275 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=0020-7543&vol= 40&iss=&firstpage=2207 [CSA]
23. Raghavachari, M. and Srinivasan, A. and Sullo, P. (1997) Poisson mixture yield models for integrated circuits: A critical review Microelectronics Reliability, 37, pp. 565-580. http://dx.doi.org/ 10.1016%2FS0026-2714%2896%2900064-9 [CROSSREF] http://www.csa.com/htbin/ linkabst.cgi?issn=0026-2714&vol=37&iss=&firstpage=565 [CSA]
24. Su, C. and Yang, T. and Ke, C. (2002) A neural-network for semiconductor wafer post-sawing inspection IEEE Transactions on Semiconductor Manufacturing, 15, pp. 260-266. http://dx.doi.org/10.1109%2F66.999602 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=0894-6507&vol= 15&iss=&firstpage=260 [CSA]
25. Taam, W. and Hamada, M. (1993) Detecting spatial effects from factorial experiments: An application from integrated circuit manufacturing Technometrics, 35, pp. 149-160. http://dx.doi.org/10.2307%2F1269660 [CROSSREF] http://www.csa.com/htbin/linkabst.cgi?issn=0040-1706&vol= 35&iss=&firstpage=149 [CSA]