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Volumn , Issue , 2008, Pages

Industry perspective on multi domain simulations and virtual prototyping

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; PROCESS ENGINEERING; PRODUCT DEVELOPMENT; PROJECT MANAGEMENT; TECHNICAL PRESENTATIONS; TECHNOLOGY TRANSFER;

EID: 56649086926     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/COMPEL.2008.4634696     Document Type: Conference Paper
Times cited : (12)

References (31)
  • 1
    • 56649089404 scopus 로고    scopus 로고
    • The 1st International ECPE Seminar on Virtual Prototyping in Power Electronics http://www.ecpe.org/, Baden-Dättwil, Switzerland, November 8-9, 2007.
    • The 1st International ECPE Seminar on Virtual Prototyping in Power Electronics http://www.ecpe.org/, Baden-Dättwil, Switzerland, November 8-9, 2007.
  • 14
    • 48749122030 scopus 로고    scopus 로고
    • Virtual prototyping and automatic code generation for DSP-based digital control of power electronics equipment
    • Troy, NY, USA, July 16-19
    • G. Wang, D. Li, A. Monti, E. Santi, "Virtual prototyping and automatic code generation for DSP-based digital control of power electronics equipment," Proc. IEEE Workshop on Computers in Power Electronics, Troy, NY, USA, July 16-19, 2006, pp123-128.
    • (2006) Proc. IEEE Workshop on Computers in Power Electronics , pp. 123-128
    • Wang, G.1    Li, D.2    Monti, A.3    Santi, E.4
  • 16
    • 0344029491 scopus 로고
    • Virtual prototyping of embedded microcontroller-based DSP systems
    • October
    • V.K. Madisetti, T.W. Egolf, "Virtual prototyping of embedded microcontroller-based DSP systems," IEEE Micro, v.15 n.5, p.9-21, October 1995.
    • (1995) IEEE Micro , vol.15 , Issue.5 , pp. 9-21
    • Madisetti, V.K.1    Egolf, T.W.2
  • 22
    • 49249120332 scopus 로고    scopus 로고
    • Simulation of the non-idealities in current sharing in parallel IGBT subsystem
    • Austin, TX, USA, February 24-28
    • M. Paakkinen, D. Cottet, "Simulation of the non-idealities in current sharing in parallel IGBT subsystem," in Proc. 23rd IEEE Applied Power Electronics Conference (APEC), Austin, TX, USA, February 24-28, 2008.
    • (2008) Proc. 23rd IEEE Applied Power Electronics Conference (APEC)
    • Paakkinen, M.1    Cottet, D.2
  • 23
    • 50249139168 scopus 로고    scopus 로고
    • Scalable PEEC-SPICE modelling for EMI analysis of power electronic packages and subsystems
    • Pan Pacific Hotel, Singapore, 6.-8. December
    • D. Cottet, M. Paakkinen, "Scalable PEEC-SPICE modelling for EMI analysis of power electronic packages and subsystems," in Proc. 8th Electronics Packaging Technology Conference (EPTC2006), Pan Pacific Hotel, Singapore, 6.-8. December, 2006.
    • (2006) Proc. 8th Electronics Packaging Technology Conference (EPTC2006)
    • Cottet, D.1    Paakkinen, M.2
  • 27
    • 34748889482 scopus 로고    scopus 로고
    • U. Drofenik, D. Cottet, A. Müsing, J.-M. Meyer, J.W. Kolar, Computationally efficient integration of complex thermal multichip power module models into circuit simulators, in Proc. 4th. Power Conversion Conference (PCC2007), Nagoya Congress Centre, Nagoya, Japan, April 2-5, 2007.
    • U. Drofenik, D. Cottet, A. Müsing, J.-M. Meyer, J.W. Kolar, "Computationally efficient integration of complex thermal multichip power module models into circuit simulators," in Proc. 4th. Power Conversion Conference (PCC2007), Nagoya Congress Centre, Nagoya, Japan, April 2-5, 2007.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.