Integrated electrical and thermal analysis of integrated power electronics modules using iSIGHT

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 2, Issue , 2001, Pages 1002-1005

  Jonah Zhou Chen, ^a   Wu, Y ^a   Gence, C ^a   Boroyevich, D ^a   Jan Helge Bohn ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER AIDED SOFTWARE ENGINEERING; COMPUTER SOFTWARE; MOSFET DEVICES; POWER INTEGRATED CIRCUITS; SIGNAL INTERFERENCE; THERMOANALYSIS;

INTEGRATED POWER ELECTRONICS MODULES (IPEM);

POWER ELECTRONICS;

EID: 0035058069     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Data exchange and software integration: Interdisciplinary design challenges
2. An advanced tool for optimized design of power electronic circuits
3. Evaluation of metal post interconnected parallel plate structure for power electronic building blocks