A systematic design approach to thermal-electrical power electronics integration

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 219-224

  Cottet, Didier ^a   Drofenik, Uwe ^b   Meyer, Jean Marc ^a  

^a ABB SWITZERLAND LTD   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COUPLED CIRCUITS; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; POWER ELECTRONICS;

DESIGN TOOLS; ELECTRICAL DESIGNS; ELECTRICAL EQUIVALENT CIRCUITS; ELECTRICAL POWERS; GROWING DEMANDS; INTEGRATION DENSITIES; LIFETIME ESTIMATIONS; LOAD CYCLES; MISSION PROFILES; MULTI DOMAINS; OPTIMIZED ALGORITHMS; ORDERS OF MAGNITUDES; POWER ELECTRONIC SYSTEMS; POWER MODULES; SYSTEMATIC DESIGN APPROACHES; SYSTEMATIC SIMULATIONS; THERMAL MANAGEMENTS;

EQUIVALENT CIRCUITS;

EID: 58149096724     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684353     Document Type: Conference Paper

References (7)

1. "PWM converter power density barriers," J.W. Kolar, U. Drofenik, J. Biela, M.L. Heldwein, H. Ertl, T. Friedli, S.D. Round, in Proc. 4th. Power Conversion Conference (PCC2007), Nagoya Congress Centre, Nagoya, Japan, April 2-5, 2007.
2. "Current and temperature distribution in multi-chip modules under inverter operation," T. Franke, G. Zaiser, J. Otto, M. Honsberg-Riedl, R. Sommer, in Proc. 8th European Conference on Power Electronics and Applications (EPE '99), Lausanne, Switzerland, 1999.
3. "Computationally efficient integration of complex thermal multi-chip power module models into circuit simulators," U. Drofenik, D. Cottet, A. Müsing, J.M. Meyer, J.W. Kolar, in Proc. 4th. Power Conversion Conference (PCC2007), Nagoya Congress Centre, Nagoya, Japan, April 2-5, 2007.
4. "Modelling the thermal coupling between internal power semiconductor dies of a water-cooled 3300V/1200A HiPak IGBT module," U. Drofenik, D. Cottet, A. Müsing, J.-M. Meyer, J.W. Kolar, in Proc. Intl. Conference on Power Electronics Intelligent Motion Power Quality (PCIM2007), Nuremberg, Germany, May 22-24, 2007.
5. "Design tools for power electronics: trends and innovations," Uwe Drofenik, Didier Cottet, Andreas Müsing, Johann W. Kolar, in Proc. 2nd intl. Conference on Automotive Power Electronics (APE2007), Paris, France, 26.-27. September 2007.
6. "3300V/1200A HiPakTM IGBT Module 5SNA 1200E330100, ABB Ltd., datasheet published on http//www.abb.ch/semiconductors, May 2005.
7. "Multi-Domain Simulation of Transient Junction Temperatures and Resulting Stress-Strain Behavior of Power Modules for Long-Term Mission Profiles," Uwe Drofenik, Ivana Kovacevic, Roland Schmidt, Johann W. Kolar, to appear in Proc. IEEE Workshop on Control and Modeling for Power Electronics (COMPEL08), ETH Zurich, Switzerland, 18.-20. August, 2008.