Cure versus flow in dispersed chip-underfill materials

Macromolecular Materials and Engineering

Volumn 293, Issue 10, 2008, Pages 828-831

  Teyssandier, Fabien ^a   Sun, Yang Y ^b   Wong, Ching P ^b   Love, Brian J ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

Chemorheology; Crosslinking; Epoxy; Sedimentation; Thermoset

Indexed keywords

CHEMORHEOLOGY; COMPETITIVE PROCESSES; CURE TEMPERATURES; CURING TEMPERATURES; DYNAMIC VISCOSITIES; EPOXY; FILLER CONCENTRATIONS; FILLER PARTICLES; GLASS FILLERS; HIGH CONCENTRATIONS; POLYMERIZATION SHRINKAGES; PROCESS MODELS; RELATIVE STABILITIES; SEDIMENTATION VELOCITIES; STOKES' LAWS; UNDERFILL; UNDERFILL MATERIALS;

ABS RESINS; CONCENTRATION (PROCESS); CURING; FILLERS; HYDRODYNAMICS; MONOMERS; POLYMERIC GLASS; POLYMERS; RESINS; THERMOSETS; VISCOSITY;

SEDIMENTATION;

EID: 55149120473     PISSN: 14387492     EISSN: 14392054     Source Type: Journal    
DOI: 10.1002/mame.200800169     Document Type: Article

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