A novel nanocomposite with photo-polymerization for wafer level application

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 1, 2008, Pages 135-142

  Sun, Yangyang ^a   Jiang, Hongjin ^a   Zhu, Lingbo ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Nanocomposite; Photo polymerization; Thermal expansion; Wafer level packaging

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FILLERS; NANOCOMPOSITES; PHOTOPOLYMERIZATION; SILICA; SILICON WAFERS; THERMAL EXPANSION; THIN FILMS;

NANOCOMPOSITE THIN FILM; SILICA FILLERS; WAFER LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 41349115327     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.916809     Document Type: Article

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