Effective elastic modulus of underfill material for flip-chip applications

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 848-850

  Qu, Jianmin ^a   Wong, C P ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CERAMIC MATRIX COMPOSITES; COMPOSITE MICROMECHANICS; ELASTIC MODULI; ELECTRONICS PACKAGING; FILLERS; FLIP CHIP DEVICES; NETWORK COMPONENTS; THERMAL EXPANSION; MORPHOLOGY; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE MODELS;

EFFECTIVE ELASTIC MODULUS; ENABLING TECHNOLOGIES; FLIP CHIP APPLICATIONS; MICRO MECHANICS MODEL; THERMAL MECHANICAL ANALYSIS; THERMAL MECHANICAL PROPERTIES; THERMOMECHANICAL RELIABILITY; TWO PHASE COMPOSITES;

MECHANICAL PROPERTIES; ELECTRONICS PACKAGING;

THERMAL MECHANICAL ANALYSIS (TMA);

EID: 0031636703     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678806     Document Type: Conference Paper

References (6)

1. Tummala, R., Ramaszewski, E., Klopfenstein, A., 1997, Microelectronics Packaging Handbook. Vol. 1, 11 and III, Chapman and Hall, NY, NY.
2. LeGall, C. A, Qu, J., McDowell, D., "Some Mechanics Issues Related To The Thermomechanical Reliability Of Flip Chip DC A With Underfill Encapsulation, " ASME, EEP-Vol. 222, p. 85-95, 1997.
3. Wong, C. P., Shi, S., Jefferson, G., " High Performance Underfill for Low-cost Flip-chip Applications", IEEE Proc. of the 47, h ECTC, p. 850, 1997.
4. Wong, C. P., Vincent, M., Shi, S., "Fast Flow and Novel No Flow Underfills : Flow Rate and CTE", ASME-Advances in Electronic Packaging, Vol. 19-1, p. 301-306, 1997.
5. Qu, J., "Effects of Slightly Weakened Interfaces on the Overall Elastic Properties of Composite Materials, " Mechanics of Materials, Vol. 14 (1993), pp. 269-281.
6. Qu, J., Wong, C. P., "Evaluation of the Effective Properties of Underfill Materials, " in preparation.