Study on the gelation of a no-flow underfill through Monte Carlo simulation

Macromolecular Chemistry and Physics

Volumn 206, Issue 8, 2005, Pages 869-877

  Zhang, Zhuqing ^a   Yamashita, Tsuyoshi ^a   Wong, Ching P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Curing reaction; Epoxy; Gelation; Monte Carlo simulation; Underfill

Indexed keywords

ADHESIVES; COMPUTER SIMULATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GELATION; MONTE CARLO METHODS; POLYMERIZATION; SUBSTRATES;

CURING REACTIONS; EPOXY MOLDING COMPOUNDS (EMC); SOLDER REFLOW; UNDERFILL;

EPOXY RESINS;

EID: 20444420937     PISSN: 10221352     EISSN: None     Source Type: Journal    
DOI: 10.1002/macp.200400466     Document Type: Article

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