Comparing the impacts of the capillary and the molded underfill process on the reliability of the flip-chip BGA

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 3, 2008, Pages 586-591

  Chen, K M ^a  

^a NATIONAL UNITED UNIVERSITY   (Taiwan)

Author keywords

Coplanarity; Flip chip; Reliability; Underfill

Indexed keywords

BRAZING; CHIP SCALE PACKAGES; DIES; ELECTRIC BREAKDOWN; ELECTRIC CURRENTS; ELECTRONIC EQUIPMENT MANUFACTURE; FLIP CHIP DEVICES; LEAD; RELIABILITY; SOLDERING; THERMAL EXPANSION; THERMAL SPRAYING; TIN; TITANIUM COMPOUNDS; WELDING;

ASSEMBLY PROCESSING; COMMUNICATION MARKET; COPLANARITY; DIE PACKAGING; DIE SIZE; FLIP CHIPPING; FLIP-CHIP; FLIP-CHIP BALL GRID ARRAY; FLIP-CHIP PACKAGING; HIGH THERMAL; INTEGRATED FUNCTIONS; LEAD-FREE; LOW COEFFICIENT OF THERMAL EXPANSION; MATE RIAL PROPERTIES; MAXIMUM STRESS; MOLDED UNDERFILL; MOLDING COMPOUND; RELIABILITY CRITERION; SIMULATION RESULTS; SOLDER BALLS; SOLDER BUMPING; UNDERFILL; UNDERFILL DISPENSING;

ELECTRONICS PACKAGING;

EID: 54849376800     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2001161     Document Type: Article

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